Product Features and Benefits

ㆍBoth copper chloride etchant of chloric acid and hydrogen peroxide type can be applied
ㆍE/F improvement increases conductor cross-section area, improves electrical characteristics
ㆍIncrease circuit design yield
ㆍLittle change in etching rate before and after adding additives
ㆍEasy wastewater treatment with low TOC concentration
ㆍNo precipitation by increasing solubility
ㆍE/F improvement effect even with a copper foil thickness of 1oz or more

E/F change according to additive concentration

Application of LEAD Frame material

 Change according to additive concentration