PRODUCTS
As a one-component type etching system made by mixing sulfuric acid, hydrogen peroxide, and a stabilizer in a certain ratio, it is a product that improves the adhesive strength between the copper surface and the Photo Resist Layer by forming a uniform roughness on the copper surface and improving the adhesive strength at the same time.
AC-110/120/150 AC-1500 |
Dry film, PSR, Au plating, OSP pretreatment |
One-component type (including sulfuric acid and hydrogen peroxide) |
AC-130 |
Half etching |
5~10㎛ Etching |
AC-1000 |
Microcircuit Pretreatment |
- |
AC AL-1000 |
Al Etching |
- |
AC-1200 |
Cu alloy |
- |
