ㆍCopper Etchant (Micro Etchant) developed for the purpose of implementing H2SO4/H2O2 type microstructure
ㆍImproved adhesive strength - excellent performance in photo resist pretreatment process
ㆍFormation of uniform roughness of the copper surface
ㆍApplicable to both inner/outer layer pre-treatment by improving adhesion of Dry Film
ㆍApplies to both Spray and Immersion
ㆍH₂SO₄ / H₂O₂ Base makes general wastewater treatment easy.
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