During DF peeling, strong alkali does not affect the base material in any way.

AC-350 is a stripper that can maintain a stable peeling speed and constant peeling particles, and does not use amines. It is a product that is easy to treat wastewater by adding special components to NaOH.

AC-370 is a KOH-based stripping solution that can maintain fast stripping speed and small and consistent stripping particles. It is a product that is easy to treat wastewater by using a small amount of amines.

AC-380, this product is suitable for products that require strong peeling power, such as DFR for LDI and Masking Ink.

For microcircuit stripping solution MSAP(Modified Semi Additive Process)

Reinforcing film for Mitsubishi sandblast can be peeled off in a short time.

AC-400 is a fully cured release agent exclusively for photo solder resist, which contains a small amount of organic solvents such as Glycol Ether, making it easy to treat wastewater and minimizing erosion of the Epoxy Substrate.