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CP OS-100

Selectively reacts only on the copper circuit part of the printed circuit board to form an organic film to protect the copper surface from oxidation, It is a chemical dedicated to surface treatment to maintain and secure excellent solderability during component mounting.
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Product Features and Benefits

ㆍExcellent workability and safety with water-soluble type
ㆍCP OS-100S (Selective Gold Type OSP) selectively forms a film only on the copper-plated surface when processing PCB where copper/gold coexist.
ㆍPeelable, easy to reprocess
ㆍAs the OSP film is removed during soldering, solder ability is excellent
ㆍSuitable for Pb-Free Soldering (3 or more reflows) due to excellent heat resistance
ㆍIt is easy to manage line concentration by supplying liquid and 10ⅹConc.
ㆍThere is almost no sludge generation due to excellent liquid stability, and even if the temperature of the OSP main tank drops to room temperature in an emergency, no precipitate is generated

 

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